简介：Theelevatedtemperaturetensileexperimentshavebeencarriedoutonthemagnesiumalloyandresultsindicatethatthemagnesiumalloyhasexcellentsuperplasticproperty.Gleebe-1500testingmachinewasusedinthediffusionbondingexperimentonthesuperplasticmagnesiumalloy.Then,theshearstrengthofthejointsunderdifferentconditionsisobtainedthroughsheartestingandtheoptimumprocessingparametersforthediffusionbondingareachieved.Bymetallurgicalmicroscopeandscanningelectronmicroscope(SEM),itisrevealedthatthemicromechanismofdiffusionbondingistheslideofgrainboundariescausedbythegrowthofgrainsandatomdiffusionofthesuperplasticmagnesiumalloy.

简介：TheZrcoatingwasdepositedontitaniumsurfaceusingthemagnetronsputteringtechnique.EffectsofZrcoatingonmicrostructureandmechanicalpropertiesofporcelainfiredtotitaniumhavebeeninvestigated.Theresultsshowthatinterdiffusionofelementsoccursduringporcelainfiring,andtheZrcoatingcaneffectivelyprotecttitaniumsurfacefromexcessoxidation.ThestrengthofbondzonewithZrcoatingdepositedfor1hourreaches29.7MPa,whichhasincreasedby26.4%ascomparedwiththatofbondzonewithoutcoating(23.5MPa).

简介：Thevacuumdiffusionbondingoftitaniumalloytotin-bronzehasbeenstudiedandthefeasibilityandappropriateprocessingparametershavebeeninvestigated.Themaximumtensilestrengthofthejointsis168MPa,andafirmjointisobtained.ThemicrostructureofdiffusionbondedjointhasbeenobservedbySEM.X-rayandEPMA,andthemainfactorsaffectingdiffusionbondinghavebeenanalyzed.TheintermetalliccompoundsTi2CuandTiCuwereformedneartheinterface.Thewidthandquantityoftheintermetalliccompoundincreaseswiththeincreaseofthebondingtime.Theformationoftheintermetalliccompoundsresultsinembrittlementofthejointandthepoorjointproperties.

简介：BondingofAl2O3tocuisperformeddirectlyusingTifoilattemperatureof1273K.Themicrostructureofthejointinterfaceisinuestigatedthroughscanningelectronmicroscope（SEM）,electron.probemicroanalysis（EPMA）andX-raydiffraction（XRD）.theeffectoftheinitialtifoilthicknessonthereactionlayerthicknessandthejointStrengthareinvestigated.

简介：Theliquid-filmsolution-diffusionbondingofZCuBe2.5alloyswasconductedusingCu-basedalloypowders.Thetensilestrengthofthebondingtimedecreasesandtheinterfacemigrationvelocityincreasesbondingtime,thethicknessofdiffusionlayerincreaseswiththeincreaseoftemperaturegradient,andthistendencybecomesmoreremarkablewiththeprolongingofbondingtime.

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简介：DD6alloywasbondedbytransientliquidphase(TLP)diffusionbonding.Themaincompositionsoftheinterlayeralloyemployedweresimilartothoseofthebasemetal,DD6,andacertainamountofelementBwasaddedasthemeltingpointdepressant.Theresultsshowthatitisdifficulttoobtainthejointswiththemicrostructurescompletelyhomogeneous.ForthejointTLPdiffusionbondedat1290℃for12h,abouthalfareasofthebeampossessedαγ+γ′microstructure,nearlyidenticalwiththatofthebasemetal,andtheotherlocalareasconsistedofT-solution,borides,etc.Prolongingthebondingtimeto24h,theinhomogeneousareasinthejointreduced,andthejointpropertyimproved.Thejointstress-rupturestrengthat980℃and1100℃reached90%-100%and70%-80%ofthoseofthebasemetalrespectively.

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简介：Dynamicsinpartialtransientliquidphasebonding(PTLPbonding)ofSi3N4ceramicwithTi/Cu/Timulti-interlayerwassystematicallystudiedthroughmicro-analysisofjointinterfaces.Theresultsshowthatgrowthofreactionlayerandisothermalsolidificationprocessiondoatthesametime.GrowthofreactionlayerandmovingofisothermalsolidificationinterfaceobeytheparaboliclawgovernedbythediffusionofparticipatingelementsduringthePTLPbonding.Coordinationoftheabovetwodynamicsprocessisdonethroughtimeandtemperature.Whenreactionlayerthicknessissuitableandisothermalsolidificationprocessisfinished,thehighbondingstrengthatroomtemperatureandhightemperatureareobtained.

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简介：Inthisstudy,atwo-stepheatingprocessisintroducedfortransientliquidphase(TLP)diffusionbondingforsoundjointswithT91heatresistantsteels.Atfirst,ashort-timehighertemperatureheatingstepisaddressedtomelttheinterlayer,followedbythesecondsteptocompleteisothermalsolidificationatalowtemperature.Themostcriticalfeatureofournewmethodisproducinganon-planarinterfaceattheT91heatresistantsteelsjoint.WeproposeatransitionalliquidphasebondingofT91heatresistantsteelsbythisapproach.Sincejointmicrostructureshavebeenstudied,wetestedthetensilestrengthtoassessjointmechanicalproperty.Theresultindicatesthatthesolidifiedbondmaycontainaprimarysolid-solution,similarcompositiontotheparentmetalandfreefromprecipitates.Jointtensilestrengthofthejointisnotlowerthanparentmaterials.Jointbend'sstrengthsareenhancedduetothehighermetal-to-metaljunctionproducinganon-planarbondlines.Nevertheless,thetraditionaltransientliquidphasediffusionbondingproducesplanarones.Bondingparametersofnewprocessare1260℃for0.5minand1230℃for4min.

简介：Anewtechnology,thetwo-steptransientliquidphasediffusionbonding(TLP-DB)technologyforcobalt-basedK640superalloy,wasinvestigated.Themethodconsistsofashort-timehightemperatureheatingtomeltinterlayerfollowedbyisothermalsolidificationofliquidphaseatalowertemperaturethanthatoftheconventionalTLP-DB.Theresultindicatesthatthetwo-stepTLP-DBcanreliablyproduceanidealjointwithuniformchemicalcomposition,whichissuperiortothejointweldedbyconventionalTLP-DBinmicrostructureandmechanicalproperties.Bondingparametersofnewprocessare1250℃for0.5hand1180℃for3h.Thehigh-temperaturetensilestrengthofthejointbytwo-stepTLP-DBreaches74%ofthatofthebasematerialonanequalbasis,butthehigh-temperaturetensilestrengthofthejointbyconventionalTLP-DBisonly58%ofthatofthebasematerial.

简介：SolderingofLD31aluminumalloysusingSn-PbsolderpasteafterelectricbrushplatingNiandCucoatingswasnvestigated.ThetechnologyofelectricbrushplatingNiandCuwasstudiedandplatingsolutionwasdeveloped.Themicrostructureofthecoatings,solderedjointandfracturefacewereanalyzedusingopticmicroscopy,SEMandEDX.Theshearstrengthofsolderedjointcouldreachashighas26.83MPa.Theresultsshowedthatreliablesolderedjointcouldbeobtainedat230℃,theadhesionofcoatingsandLD31aluminumalloysubstratewashighenoughtobearthethermalprocessinthesoldering.

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简介：Microstructuresandmechanicalpropertiesoftransientliquidphase(TLP)bondedmagnesiummetalmatrixcomposite(MMC)jointsusingcopperinterlayerhavebeeninvestigated.Withanincreaseofbondingtimesfrom5minto50minatbondingtemperatureof510℃,theaverageconcentrationofcopperinthebondedzonedecreased,themicrostructureinthezonechangedfromCu,α-MgandCuMg2toα-Mg,CuMg2andTiC,andmechanicalpropertiesofthejointincreased.Theshearstrengthofthejointbondedat510℃for50minreached64MPaduetothemetallurgicalbondingofthejointandimprovingitshomogeneityofcompositionandmicrostructure.ItisfavorabletoincreasethebondingtimeforimprovingmechanicalpropertiesofTLPbondedmagnesiumMMCjoint.