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2009年4期
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TLP bonding of alumina ceramic and 5A05 aluminum alloy using Ag-Cu-Ti interlayer
TLP bonding of alumina ceramic and 5A05 aluminum alloy using Ag-Cu-Ti interlayer
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摘要
未填写
DOI
5joo0v03jv/834912
作者
王颖;曹健;冯吉才;张丽霞;徐富家
机构地区
不详
出处
《中国焊接:英文版》
2009年4期
关键词
氧化铝陶瓷
铝合金
张力腿
钛
银
铜
分类
[金属学及工艺][焊接]
出版日期
2009年04月14日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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来源期刊
中国焊接:英文版
2009年4期
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相关关键词
氧化铝陶瓷
铝合金
张力腿
钛
银
铜
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