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Role of temperature gradient in liquid／solid phase solution-diffusion bonding

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摘要 Theliquid-filmsolution-diffusionbondingofZCuBe2.5alloyswasconductedusingCu-basedalloypowders.Thetensilestrengthofthebondingtimedecreasesandtheinterfacemigrationvelocityincreasesbondingtime,thethicknessofdiffusionlayerincreaseswiththeincreaseoftemperaturegradient,andthistendencybecomesmoreremarkablewiththeprolongingofbondingtime.

DOI lg4q9qqrj8/280696

作者翟秋亚;徐锦锋

机构地区不详

出处《中国焊接：英文版》 2004年2期

关键词扩散焊接温度梯度压焊时间液态膜铜合金

分类 [金属学及工艺][焊接]

出版日期 2004年02月12日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

中国焊接：英文版

中国焊接：英文版

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相关关键词

扩散焊接温度梯度压焊时间液态膜铜合金

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