简介：ThemicrostructureandtensilepropertiesofSn-9Znsolderunderdifferentcoolingandagingconditionwerestudied.Duringsolidification,thedistributionofZn-richphasesandgrainsizeinthemicrostructureofSn-9Znsolderweredecidedbythecoolingrate.TheZn-richphaseinSn-9Znsolderunderfurnacecooling,aircoolingandwatercoolingmediawasseparatelyexistedascoarsendendriticandneedlelikeshape,fineneedlelikeshapeandveryfinerod-likeshape,respectively.Afteraging,thecoarsendendriticwasbrokenandthecoarsenneedlelikeZn-richphasewaspartlychangedintofinedistributionofZn-richphaseforSn-9Znsolderwithfurnacecooling,andtherod-likeZnphaseintheSn-9ZnsolderunderwatercoolingwaschangedtoconglomeratedZnwithneedleshape.DuringtensiletestingonSn-9Znsolder,tensilestrengthandductilityreachedthebestwithwatercooling,butdecreasedwithagingeffect.Meanwhile,theductilityofsolderwithaircoolingandthestrengthofsolderwithfurnacecoolingincreasedwithaging.Thefracturemodewasductileandwasindependentofcoolingmediaandagingeffect.Thesizeanddepthofdimplesdecreasedfromwater,furnacetoaircooling.Afteraging,numberandsizeofdimplesincreasedonthesolderwithfurnacecoolingandaircooling.ThechangeonthesizeofdimplesfortheSn-9Znsolderunderdifferentcoolingconditionandwithagingeffectwasaccordancetothetensileproperties.
客服QQ：30444492琼网文【2021】1550-113号
增值电信业务经营许可证：琼B2-20210322
出版物经营许可证：新出发龙华出字第(2021)009号
广播电视节目制作经营许可证：(琼)字第00779号
版权所有 ©2002-2024 期刊网(www.qikanchina.com) 琼ICP备2021005105号
