简介:摘要:具有宽带隙、高电子饱和速度和高击穿电压等良好特性的氮化镓(GaN)材料作为第三代半导体材料——宽禁带半导体材料之一,推动微电子领域和光电子学领域向前迈出了极为重要和有重大意义的一步,而以GaN材料制造的功率半导体器件AlGaN/GaN HEMT器件对半导体器件领域的发展也有着极其重大的影响。本文概述了GaN材料的基本特性以及AlGaN/GaN HEMT 器件的工作原理。
简介:DepletionmodeHEMTwithrefractorymetalsilicideWSigatehasbeende-signedandfabricated.Epicated.Epitaxialmodulationdopingmaterialsweregrownbyahome-madeMBEsystem.Thegatelengthandwidthforlownoisedepletiondeviceswere1.2~1.5μmand2×160μmrespectively.Theelectronmobilityofthefabricateddevicesistypically6080cm^2/V·sat300Kand68000cm^2/V·sat77K.Thesheetelectronconcentrationnsis9×10^11cm^-2,Thesource-draincontactswithAuGeNi/Auwerefabricatedusingevaporatingandlift-offtechnique.tofurtherreducethecontactresistance,thewaferalloyedat520℃for3mininthehydrogen(H2)gas.SchottkygatewasformedusingWSi.Thetranseon-ductanceofthedepletionmodedeviceis110~130mS/mmatroomtemperature,Thede-vicescanbeappliedincommunicationsatelliteatmicrowavefreqencyof3.83GHzandradarreceiverat1.5GHz.Itsnoisefigureisabout2~3dB.