摘要
Laminatedhard-softintegratedstructuresplayasignificantroleinthefabricationanddevelopmentofflexibleelectronicsdevices.Flexibleelectronicshaveadvantageouscharacteristicssuchassoftandlight-weight,canbefolded,twisted,flippedinside-out,orbepastedontoothersurfacesofarbitraryshapes.Inthispaper,ananalyticalmodelispresentedtostudythemechanicsoflaminatedhard-softstructuresinflexibleelectronicsunderastickupstate.Thirdorderpolynomialsareusedtodescribethedisplacementfield,andtheprincipleofvirtualworkisadoptedtoderivethegoverningequationsandboundaryconditions.Thenormalstrainandtheshearstressalongthethicknessdirectioninthebimaterialregionareobtainedanalytically,whichagreewellwiththeresultsfromfiniteelementanalysis.Theanalyticalmodelcanbeusedtoanalyzestickupstatelaminatedstructures,andcanserveasavaluablereferenceforthefailurepredictionandoptimaldesignofflexibleelectronicsinthefuture.
出版日期
2018年01月11日（中国期刊网平台首次上网日期，不代表论文的发表时间）
