摘要
Fatiguecrackingtestsofasolderjointwerecarriedoutusingin-situscanningelectronmicroscopy(SEM)technologyundertensileandbendingcyclicloadings.Themethodforpredictingthefatiguelifeisprovidedbasedonthefatiguecrackgrowthrateofthesolderjoint.Theresultsshowthattheeffectoftheloadingtypeonthefatiguecrackgrowthbehaviorofasolderjointcannotbeignored.Inaddition,thefiniteelementanalysisresultshelpquantitativelyestimatetheresponserelationshipbetweensolderjointstructures.Thefatiguecrackinitiationlifeofasolderjointisingoodagreementwiththefatiguelife(N50%)ofatotallyelectronicboardwith36solderjoints.
出版日期
2014年03月13日(中国期刊网平台首次上网日期,不代表论文的发表时间)